Reflow and curing oven
Description
The reflow oven LPKF Protoflow S is for reflow and curing electronic assembly.
Capacities
- Reflow atmosphere: inert gas and forming gas
- Process temperature of 30 - 320°C
- Controlled by PC
- Work piece dimensions: 230 x 305 mm².
Applications
Reflow oven performs reflow of different solders (including lead-free), curing varieties of adhesives.
