Reflow and curing oven
Description
The reflow oven LPKF Protoflow S is used for reflow and curing of electronic assemblies.
Specifications
- Reflow atmosphere: inert gas and forming gas
- Process temperature: 30 to 320°C
- PC-controlled operation
- Workpiece dimensions: 230 x 305 mm².
Applications
The reflow oven reflows different solders (including lead-free) and cures various adhesives.
