Semi-automatic wire bonder

Description

The semi-automatic TPT HB-16 tool is used for Al ultrasonic and Au thermosonic wire bonding. This is a compact and flexible tool for quick prototyping and small-series production.

Specifications

Bonding types: ball, wedge and stud-ball bumping
Wires: aluminum and gold, 18 to 75 μm in diameter
Aluminum and gold ribbon of 25 to 100 μm
Deep-access bonding (16 mm tool)
Force range: 15 to 110 g
Ultrasonic power: 0 to 2 W
X, Y and Z motorized axes
Programmable loop shape
Operating modes: manual, step-by-step, semi-automatic, stitch bonding.

Applications

The machine performs wire bonding: die to package, die to PCB (chip-on-board), die to die (stacked IC).