Semi-automatic wire bonder

Description

Semi-automatic TPT HB-16 tool is for Al ultra-sonic and Au thermo-sonic wire-bonding. This is a compact and flexible tool for quick prototyping and small series production.

Capacities

Type of welding: ball, wedge and stud ball bump
Wires: aluminum and gold of 18 - 75 μm of diameter
Aluminum and gold ribbon of 25 - 100 μm
Deep access bonding (tool of 16 mm)
Force range: 15 to 110 gr
Ultrasonic power range: 0 to 2 W
X, Y and Z motorized axis
Programmable loop shape
Operating modes: manual, step by step, semi-auto, stitch bonding.

Applications

The machine performs the wire-bonding: die to package, die to PCB (chip on board), die to die (stacked IC).