Submicron Die and Flip-Chip bonder
Description
The flexible FINEPLACER® lambda system from Finetech is a submicron die-bonder for high-precision die attach and advanced chip packaging.
Specifications
- Automated processes (temperature, force) and integrated process management
- Real-time process observation camera
- Placement of components with lateral dimensions from 250 μm up to 10x10 mm²
- Thermo-compression bonding including flip-chip (maximum force of 10 kg)
- Soldering technique: lead-free, AuSn, indium, etc.
- Adhesive bonding
- Rework option
- Pattern recognition software
- X, Y and Z work table and head rotation
- Placement accuracy: ±0.5 μm
- Compatible with formic acid (maximum concentration of 85%).
Applications
Typical fields of application include R&D, prototyping and low-volume production. The system handles a wide range of applications, including:
- Precise flip-chip and die bonding of CMOS devices
- Sensor and MEMS packaging
- Micro-optics assembly and multi-stage assembly of micro-opto-electro-mechanical systems (MOEMS)
- Laser bar, LED, VCSEL/photodiode bonding
- Chip-on-glass, chip-on-flex.
