Submicron Die and Flip Chip bonder
Description
The flexible FINEPLACER® lambda system from Finetech is a sub-micron die-bonder for high precision die attach and advanced chip packaging.
Capacities
- Automated processes (temperature, force) and Integrated Process Management
- Real time process observation camera
- Placement of component of lateral dimensions of 250 μm and larger up to 10x10 mm²
- Thermo-compression bonding including flip-chip (maximum force of 10 kg)
- Soldering technique (lead-free, AuSn, Indium, etc.)
- Adhesive technology
- Rework option
- Patterning recognition software
- X, Y and Z work table and head rotation
- Placement accuracy: ±0.5 μm
- Suitable for formic acid with maximum concentration of 85%.
Applications
Typical fields of application include R&D, prototyping and low-volume production. The system handles a wide range of applications, including:
- CMOS precise flip chip and die bonding
- Sensor and MEMS packaging
- Micro optics assembly and multi-stage assembly of opto-electro mechanical systems (MOEMS)
- Laser bar, LED, VCSEL/photo diode bonding
- Chip on glass, chip on flex.
