Decapsulation

Description

The chemical decapsulation system is dedicated to decapsulation of plastic electronic packages. Decapsulation is necessary to access the silicon die for analysis.

Specifications

Process liquids: nitric acid, sulfuric acid and mixtures
Temperature: 40 to 250°C
Flow rate: 2 to 10 mL/min
Mask and accessories for decapsulation of all types of packages (including BGA and micro-BGA).