Automatic wire bonder: wedge and ball bonding

Description

The Hesse BJ653 is a fully automatic machine with interchangeable bond heads for thermosonic and ultrasonic Au and Al wire bonding. The machine is suitable for prototyping as well as for mass production.

Specifications

Bonding types: ball-wedge, stud-ball bumping, wedge-wedge
Operating frequency: 94 kHz (single), 60/120 kHz (dual)
Wires: aluminum and gold, 18 to 75 μm in diameter
Force range: 10 to 150 cN
Ultrasonic power: 0.1 to 2.5 W
X, Y and Z motorized axes
440° rotating head
Programmable loop shape.

Applications

The machine performs Au and Al wire bonding: die to package and die to PCB (chip-on-board), die to die (stacked IC), stud-ball bumping.