Dicer

Dicer

Description

The DISCO DAD-341 Dicing Saw (Dicer) is an automatic system for the singulation of wafers, carriers, PCBs and substrates into individual dies and segments.

Specifications

  • Fully automatic PC-controlled system
  • Dicing area: 200 mm (8″) diameter
  • Dicing thickness range: 10 μm to 2 mm
  • Spindle output power: 1,000 W
  • Spindle rotation speed: 3,000 to 60,000 rpm
  • Feed speed: 0.1 to 400 mm/s
  • Dicing street width: depends on the blade thickness (blades down to 10 μm thick are supported)
  • Optical height sensor with a non-contact setup option
  • Automatic vision system and inspection camera
  • Automatic alignment
  • Suitable for cutting any substrate or carrier made of materials used in microelectronics such as Si, glass, ceramic, GaAs, PCB, etc.
  • Cleanroom-compatible with class 10,000 (ISO 7)
  • Equipped with ESD protection
  • Accepts 2″-diameter hub-type and M-flange-type blades.

Applications

The DISCO DAD-341 Dicer is an automatic system suitable for:

  • Singulation of wafers, carriers, PCBs, substrates, etc., of regular and/or irregular shape up to 8″ (200 mm) in diameter into individual dies and segments
  • Singulation of multi-project wafers
  • Cutting any materials used in microelectronics, such as Si, glass, ceramic, GaAs, PCB, plastic, laminates and others
  • Through-cutting and grooving of the materials mentioned above.
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