Dicer
Description
The DISCO DAD-341 Dicing Saw (Dicer) is an automatic system for singulation wafers, carriers, PCB and substrates on the individual dies and segments.
Capacities
- Fully automatic PC controlled system
- Dicing area: 200 mm (8") diameter
- Dicing thickness range: 10 μm to 2 mm
- Spindle output power: 1000 W
- Spindle rotation speed: 3.000-60.000 rpm
- Feed speed: 0.1 mm/s-400 mm/s
- Dicing street width, depends on the dicing blade thickness, compatible with 10 µm thick blades
- Optical height sensor includes non-contact setup option
- Automatic vision system and inspection camera
- Auto alignment
- Suitable to cut any substrate and carrier made up of any material used in microelectronic as Si, glass, ceramic, GaAs, PCB, etc.
- Cleanroom compatible to class 10,000 (ISO7)
- Equipped with ESD protection
- Applicable for 2" diameter hub type and M-flange type blade.
Applications
The DISCO DAD-341 Dicer is an automatic system suitable for
- singulation wafers, carriers, PCB, substrates and etc. regular and/or irregular shape up to 8" (300 mm) diameter on the individual dies and segments
- singulation multi-project wafers
- cutting any materials used in microelectronic, as following Si, glass, ceramic, GaAs, PCB, plastic, laminates and others
- cut through and grooving mentioned above materials.
