Flip chip bonder
Description
Flip Chip bonder PP6 is a semi-automatic tool for accurate mounting semiconductors components on all types of substrate.
Capacities
- Placement of component of lateral dimensions of 250 μm an larger up to 10x10 mm²
- Thermo-compression flip-chip bonding (maximum force of 5 kg)
- Rework option
- Patterning recognition software
- Ejection of the die from diced wafer, picking and mounting
- Adhesive and solder automatic dispensing
- X, Y and Z motorized table and head rotation
- Operating mode: manual and semi-automatic
- Placement accuracy: ±5 μm.
Applications
The Flip Chip bonder PP6 performs flip chip bonding of electronic components such as SMD, bare die, BGA and micro BGA.
