Flip-Chip bonder (PP6)
Description
The Flip-Chip bonder PP6 is a semi-automatic tool for accurate mounting of semiconductor components on all types of substrates.
Specifications
- Placement of components with lateral dimensions from 250 μm up to 10x10 mm²
- Thermo-compression flip-chip bonding (maximum force of 5 kg)
- Rework option
- Pattern recognition software
- Die ejection from diced wafers, picking and mounting
- Automatic adhesive and solder dispensing
- Motorized X, Y and Z table and head rotation
- Operating modes: manual and semi-automatic
- Placement accuracy: ±5 μm.
Applications
The Flip-Chip bonder PP6 performs flip-chip bonding of electronic components such as SMD, bare die, BGA and micro-BGA.
