Automatic wire bonder: wedge bonding

Automatic wire bonder Head of the automatic wire bonder

Description

The Hesse & Knipps BJ710 is a fully automatic machine for ultrasonic wire bonding. The machine is suitable for prototyping as well as for mass production.

Specifications

  • Bonding type: wedge-wedge
  • Operating frequency: 90 kHz
  • Wires: aluminum and gold, 18 to 75 μm in diameter
  • Force range: 10 to 150 cN
  • Ultrasonic power: 0.1 to 2.5 W
  • X, Y and Z motorized axes
  • 360° rotating head
  • Programmable loop shape.

Applications

The machine performs wire bonding: die to package and die to PCB (chip-on-board), die to die (stacked IC).

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