Our equipment
Micro-assembly and Packaging
- 3D Printer Ultimaker
- Automatic dispenser
- Automatic wire bonder: wedge and ball bonding
- Automatic wire bonder: wedge bonding
- Autotronik SMT Pick & Place
- Dicer
- Dry cabinet
- Flip chip bonder (PP6)
- Hermetic sealing oven
- Laser
- Low pressure molding system
- Milling CNC machine 3 axis
- Milling machine Datron
- Pico-liter fluid dispenser
- Polisher and Grinder
- Reflow and curing oven
- Scriber
- Semi-automatic wire bonder
- Submicron die and flip chip bonder
- UV illumination and curing spot
- Vacuum mixer
- Winding machine
